Overview of 99.99% -99.9999% Titanium Ti Sputtering Plate Titanium Target for Vacuum Coating
Titanium (Ti) is a chemical element with the atomic number 22 and is symbolized as Ti on the periodic table. It belongs to the transition metals group and is known for its low density, high strength-to-weight ratio, and exceptional corrosion resistance. Discovered in 1791 by William Gregor, titanium has become a vital material across numerous industries due to its unique combination of properties.
Feature of 99.99% -99.9999% Titanium Ti Sputtering Plate Titanium Target for Vacuum Coating
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Low Density and High Strength: Titanium is about 45% lighter than steel but possesses similar strength, making it ideal for applications where weight reduction is critical without compromising strength.
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Corrosion Resistance: It forms a passive oxide layer that protects the underlying metal from corrosive substances, including sea water and chlorine, making it highly resistant to corrosion.
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Biocompatibility: Titanium is well-tolerated by the human body and doesn’t cause adverse reactions, which is why it’s widely used in medical implants and surgical instruments.
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Heat Resistance: With a melting point of 1,668°C (3,034°F), titanium can withstand high temperatures, making it suitable for aerospace and automotive applications.
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Non-Magnetic and Non-Toxic: These properties make titanium ideal for applications in MRI machines and other sensitive electronic devices.
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Fatigue Resistance: Titanium demonstrates excellent resistance to metal fatigue, crucial in cyclic loading applications such as aircraft parts.
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(99.99% -99.9999% Titanium Ti Sputtering Plate Titanium Target for Vacuum Coating)
Parameters of 99.99% -99.9999% Titanium Ti Sputtering Plate Titanium Target for Vacuum Coating
The TiSputtering Plate is an essential component in the TiSputtering process, which involves vaporizing titanium and depositing it onto a substrate to form a thin layer of titanium with improved properties compared to pure titanium.
The TITANISPUTTER PLATE is typically made of high-purity titanium, and its performance can be influenced by several factors such as composition, thickness, and purity. The target itself can affect the TiSputtering process in several ways, including the concentration of Ti3+ ions, the stoichiometry of the reaction mixture, and the rate of ionization.
One parameter that can affect the TiSputtering process is the TITANISPUTTER PLATE thickness. The thickness of the TITANISPUTTER PLATE determines the amount of titanium that is deposited on the substrate. A thicker TITANISPUTTER PLATE can result in more being deposited, but it may also increase the risk of chemical reactions between the TiO2 and other elements present in the reaction mixture, leading to unwanted byproducts.
Another parameter that can affect the TiSputtering process is the TiSputtering conditions, such as pressure, temperature, and gas flow rate. High pressures and temperatures can increase the rate of Ti deposition, while low pressures and temperatures can slow down the rate. Additionally, the choice of gases used in the TiSputtering process can also affect the TiSputtering properties of the material being deposited.
Overall, the TITANISPUTTER PLATE plays a crucial role in the TiSputtering process, and optimizing its parameters is essential for achieving desired Ti properties. Therefore, careful consideration of these parameters and their effects on the TiSputtering process should be taken into account when designing and optimizing the TITANISPUTTER PLATE.
(99.99% -99.9999% Titanium Ti Sputtering Plate Titanium Target for Vacuum Coating)
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(99.99% -99.9999% Titanium Ti Sputtering Plate Titanium Target for Vacuum Coating)
